We have a 2nd occurrence. Same result, but this time it peeled up from the standard insertion force of our Type-C Wallwart. Again, the reflow for the connector did not succeed in wicking solder to the connector housing tabs. The paste is in a symmetrical mound on the trace, which to me is an indication of improper reflow. I spoke with our designer and he has seen this before on a different project, in his case the pads ripped up from the board. The solution for him was to RMA the boards, so that solder could be applied to the strain relief tabs from the bottom of the board.
The Pis on our project will see outdoor weather temperature cycling over years, while the PoE splitter USB cable applies bend radius pressure to the pads and paste. ROHS solder is brittle, so we have concerns that we will see expensive failures in the field. My rework folks are very good, and could knock out the first 120 units with solder from the back. But, this would likely violate the warranty.
Improper reflow is arguably a manufacturing defect, so we are looking for guidance here.
Thank ypu
The Pis on our project will see outdoor weather temperature cycling over years, while the PoE splitter USB cable applies bend radius pressure to the pads and paste. ROHS solder is brittle, so we have concerns that we will see expensive failures in the field. My rework folks are very good, and could knock out the first 120 units with solder from the back. But, this would likely violate the warranty.
Improper reflow is arguably a manufacturing defect, so we are looking for guidance here.
Thank ypu
Statistics: Posted by CDunson — Wed Oct 29, 2025 6:21 pm